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200mm Sintered Diamond Lap Disc – for Gemstone & Glass Grinding
200mm Sintered Diamond Lap Disc – for Gemstone & Glass Grinding
200mm Sintered Diamond Lap Disc – for Gemstone & Glass Grinding
200mm Sintered Diamond Lap Disc – for Gemstone & Glass Grinding
200mm Sintered Diamond Lap Disc – for Gemstone & Glass Grinding
200mm Sintered Diamond Lap Disc – for Gemstone & Glass Grinding

200mm Sintered Diamond Lap Disc – for Gemstone & Glass Grinding

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Product Attributes

Model No.HNKM60710

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Product Description

Product Description

Product Name:

200mm Sintered Diamond Grinding Disc / Lap Disc (Metal Bond)

Key Specifications:

 
 
Parameter Value
Outer Diameter (OD) 200 mm
Abrasive Type Sintered diamond (metal bond)
Bond Type Sintered metal bond (bronze/iron/cobalt based)
Diamond Distribution Throughout the working layer (self-sharpening)
Application Grinding, lapping, and surface preparation
Target Materials Gemstones, glass, crystals, ceramics, hard stones

Product Description:

This 200mm sintered diamond grinding disc (lap disc) is specifically designed for grinding, lapping, and surface finishing of gemstones, glass, and other hard, brittle materials.

Unlike electroplated discs where diamond is only on the surface, this sintered metal bond disc has diamond grit distributed throughout the entire working layer. As the disc wears, fresh diamond is continuously exposed – providing consistent cutting performance and extended service life.

Typical applications include:

  • ✅ Gemstone faceting and shaping – quartz, topaz, sapphire, ruby

  • ✅ Glass grinding and edge finishing – flat glass, optical glass, glass art

  • ✅ Crystal and ceramic lapping – precision surface preparation

  • ✅ Hard stone shaping – granite, marble, engineered stone


Part 1: Key Features

 
 
Feature Benefit
200mm diameter Large working surface – efficient for multiple parts
Sintered metal bond Long life – diamond throughout the working layer
Self-sharpening Fresh diamond exposed as disc wears – consistent cutting
Versatile Works on gemstones, glass, ceramics, and hard stones
Cool grinding Good heat dissipation – prevents thermal damage
Dressable Can be dressed to refresh the surface when needed
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Sintered vs. Other Technologies:

 
 
Feature Sintered Diamond (This) Electroplated Diamond Brazed Diamond
Diamond distribution Throughout working layer Single layer Single layer
Self-sharpening ✅ Yes ❌ No ❌ No
Life ⭐⭐⭐⭐⭐ Longest ⭐⭐ Short ⭐⭐⭐⭐ Long
Sharpness ⭐⭐⭐ Moderate ⭐⭐⭐⭐ Sharp ⭐⭐⭐⭐⭐ Sharpest
Can be dressed? ✅ Yes ❌ No ❌ No
Best for Production, long life Occasional use Aggressive cutting

Part 2: Why Sintered Diamond for Gemstones & Glass?

Gemstones and glass are hard, brittle materials that require diamond abrasive for efficient grinding.

 
 
Material Hardness (Mohs) Abrasive Requirement
Quartz (amethyst, citrine) 7 Diamond required
Topaz 8 Diamond required
Corundum (sapphire, ruby) 9 Diamond required
Glass 5-7 Diamond recommended
Crystal 7 Diamond required

Abrasive Suitability:

 
 
Abrasive Suitability for Gemstone/Glass Reason
Sintered Diamond ⭐⭐⭐⭐⭐ Excellent Long life, consistent cutting
Electroplated Diamond ⭐⭐⭐⭐ Good Sharp but shorter life
Brazed Diamond ⭐⭐⭐⭐⭐ Excellent Sharp, but more expensive
Silicon Carbide ⭐⭐⭐ Moderate Not hard enough for hard stones
Alumina ⭐⭐ Poor Wears quickly

Part 3: Sintered Diamond Technology – How It Works

Sintered diamond is made by mixing diamond grit with metal powder (bronze, cobalt, or iron-based) and then sintering – heating and compressing until the metal fuses around each diamond grain.

Self-Sharpening Mechanism:

 
 
Stage Action
1 Diamond grains cut the material
2 As grains dull, the metal bond wears slightly
3 Dull grains are released
4 Fresh, sharp diamond grains are exposed
5 The disc continues cutting at consistent speed

Self-Sharpening Benefit:

 
 
Benefit Explanation
Consistent performance No drop-off in cutting speed as the disc wears
Long life Diamond throughout the working layer – more total cutting
Lower cost per part Fewer disc changes – lower cost over time

Part 4: Specifications

 
 
Parameter Value / Range
Outer Diameter (OD) 200 mm
Abrasive Sintered diamond (metal bond)
Grit range #60 – #1200 (depending on application)
Bond type Sintered metal
Disc thickness Custom (per customer requirement)
Bore / Arbor Custom (per customer machine)
Application Gemstone, glass, hard material grinding
Target materials Gemstones, glass, ceramics, hard stones

Recommended Grit by Application:

 
 
Application Recommended Grit
Rough shaping / stock removal #60-120
General grinding #150-240
Fine grinding / surface prep #320-600
Polishing preparation / fine lapping #800-1200

Part 5: Applications

Gemstone Grinding & Faceting

 
 
Gemstone Type Hardness (Mohs) Application
Quartz (amethyst, citrine) 7 Faceting, cabochon shaping
Topaz 8 Pre-forming, flat lapping
Corundum (sapphire, ruby) 9 Rough grinding, surface preparation
Beryl (emerald, aquamarine) 7.5-8 Shaping, faceting
Garnet 6.5-7.5 General grinding

Glass Grinding Applications:

 
 
Glass Type Application
Optical glass Lens blank pre-forming, edge grinding
Flat glass Surface preparation, edge smoothing
Stained glass Edge shaping, surface smoothing
Glass art Sculpture shaping, bevel grinding
Crystal Faceting, polishing prep

Other Compatible Materials:

 
 
Material Suitability
Ceramics ⭐⭐⭐⭐⭐ Excellent
Hard stones (granite, marble) ⭐⭐⭐⭐⭐ Excellent
Carbide ⭐⭐⭐⭐⭐ Excellent
Composites ⭐⭐⭐⭐ Good
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