$789-980 /Piece/Pieces
| Payment Type: | T/T,Paypal,Money Gram,Western Union,Others |
| Incoterm: | FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery |
| Min. Order: | 1 Piece/Pieces |
| Transportation: | Ocean,Land,Air,Express,Others |
| Port: | Zhengzhou,Qingdao,Shanghai |
Model No.: HNKMRBGW013
Brand: Kemei ABRASIVES
Support Customization: Oem, Odm, Obm
Place Of Origin: China
Species: Abrasive Disc
Material: Diamond Abrasive: Mesh size:200 grit
Bond: Resin: Diameter:200mm
Working Layter: Three Rows: Feature: on grinder
Thickness : 45mm: Bore Size: 127mm
| Selling Units | : | Piece/Pieces |
| Package Type | : | carton bubble wrap,wooden pallet |
| Picture Example | : |
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The IF Series in-feed Grinding Wheels are excellent for processing not only silicon, but also compound semiconductors, ceramics, crystals, and a wide range of other materials. In addition, kemei offers applications and IF Series wheels to match virtually any wafer size or processing requirement. Capable of precision grinding to planarize etched wafers.
Kemei produces all kinds of Diamond Grinding Wheels, such as metal bond and Resin Bond Grinding Wheels which are used for all kinds of applications. Contact us for more information.
Product Parameters:
Material : diamond abrasive
Bond : resin bond
Brand: KEMEI
Feature: high precision grinding wheels
Compatible Material :silicon wafer, silicon-based chips, crystal,
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