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500mm Electroplated Diamond Cutting Blade
500mm Electroplated Diamond Cutting Blade
500mm Electroplated Diamond Cutting Blade
500mm Electroplated Diamond Cutting Blade
500mm Electroplated Diamond Cutting Blade
500mm Electroplated Diamond Cutting Blade
500mm Electroplated Diamond Cutting Blade

500mm Electroplated Diamond Cutting Blade

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Product Attributes

Model No.HNKM60505

Packaging & Delivery

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Product Description

Product Description

Product Name:

500mm Electroplated Diamond Cutting Blade (Type: Electroplated / Outer Diameter 500mm)

Key Specifications:

 
 
Parameter Value
Outer Diameter (OD) 500 mm
Abrasive Type Synthetic diamond (electroplated bond)
Grit Size 30 / 35 mesh (coarse)
Application Material Piezoelectric ceramic (PZT), hard & brittle ceramics
Mounting Custom flange / arbor hole (to be confirmed per machine)
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Product Description:

This 500mm electroplated diamond cutting blade is specifically engineered for high-efficiency, precision slicing of piezoelectric ceramics (PZT) .

Piezoelectric ceramics are extremely hard, brittle, and wear-resistant – making them difficult to cut with conventional abrasive wheels. This blade solves that problem by using a single-layer, high-concentration electroplated diamond coating bonded firmly to a steel core.

The 30/35 grit provides:

  • ✅ Aggressive cutting action for faster feed rates

  • ✅ Reduced cutting heat generation

  • ✅ Clean cut surfaces with minimal edge chipping when parameters are optimized

Why Electroplated for PZT Ceramic?

 
 
Feature Benefit for PZT Cutting
Thin diamond layer Thin kerf = less material waste
High diamond exposure Cuts through hard ceramic without glazing
No metal bond matrix Reduced friction and heat
Sharp cutting edge Lower cutting force, less crack risk
Uniform grit distribution Smooth, consistent cut quality

Recommended Cutting Conditions (for reference):

 
 
Parameter Recommendation
Cutting speed (Vs) 30 – 40 m/s
Feed rate Slow to moderate (material dependent)
Coolant Water-based flood coolant required
Machine type High-rigidity ceramic dicing / slicing saw

⚠️ Important:
Piezoelectric ceramics are sensitive to thermal and mechanical shock.
Always use sufficient coolant flow to prevent cracking.
A coarse grit like 30/35 is preferred for thicker workpieces or high removal rate applications.

Typical Applications:

  • Dicing piezoelectric ceramic plates / blocks

  • Slicing PZT wafers for sensors, actuators, transducers

  • Cutting other hard & brittle ceramics (alumina, zirconia, ferrite)

Available Options (upon request):

  • Different grit sizes (e.g., 60/80 for finer cuts)

  • Custom arbor hole diameter

  • Special edge profiling (if required)

Package Includes:

1 × 500mm Electroplated Diamond Cutting Blade (30/35 grit)

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