Types of Diamond Cutting Blade and Difference

The sintered diamond Saw Blade is a multi-layer diamond that is inlaid on the saw blade after the diamond and the binder are mixed, pressed and sintered.

When cutting, the outer layer of diamond is ground down, and the inner layer leaks out, until the sintered part is gone, it is scrapped.

Brazing diamond saw blades rely on the chemical metallurgical action of the solder during brazing to bond the diamond and the substrate together, forming a single-layer diamond.

Solder and diamond will react, but have the characteristics of not damaging diamond, and the same with the substrate. In this way, the diamond and the matrix are fused together, and the holding force of the diamond is enhanced. The brazing filler metal is very thin after reaction, most of the diamonds are outside, and about 70% of them will participate in the grinding, the grinding efficiency is very high, and it will not be blocked.

Electroplating diamond is based on the principle of electroplating. A layer of metal such as nickel is plated on the surface of the substrate, and then the diamond is sprinkled on it, and the diamond is covered by nickel. It is a single layer of diamond, and less than 50% of the diamond is exposed. Wrapping the diamond, once the cutting force is too large, the diamond will collapse and lose the processing ability.

By comparison of sharpness:

electroplated diamond cutting discs > brazed cutting discs > sintered cutting discs

By comparison of durability:

sintered diamond cutting discs > brazed cutting discs > electroplated cutting discs